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  4. Standard "BS IEC 63011-2:2018"
Standard BS IEC 63011-2:2018 24.1.2019 preview

BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect.

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STANDARD published on 24.1.2019


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The information about the standard:

Designation standards: BS IEC 63011-2:2018
Publication date standards: 24.1.2019
SKU: NS-915405
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS

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The category - similar standards:

Integrated circuits. Microelectronics

Annotation of standard text BS IEC 63011-2:2018 :

ISBN: 978 0 580 97375 8 Status: Definitive

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