Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
ČSN EN IEC 61189-5-601 (359039)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Translate name
STANDARD published on 1.8.2021
The information about the standard:
Designation standards: ČSN EN IEC 61189-5-601
Classification mark: 359039
Catalog number: 512555
Publication date standards: 1.8.2021
SKU: NS-1030521
The number of pages: 52
Approximate weight : 156 g (0.34 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Annotation of standard text ČSN EN IEC 61189-5-601 (359039):
This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering. This document covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 listed in Table 1: Table 1 - Test items defined in this document Number of test method Test Method Tg1 Solder joint initial quality after reflow Reflow Tg2 Warpage of component and printed boards in reflow process Tg3 Resistance to soldering heat of printed boards Tg4 Wetting and dewetting of printed board land Tg5 Resistance to dissolution of printed board land Tg6 Pull strength of the test substrate land NOTE - The test methods do not apply to the solder bath method
Preview of the standard ČSN EN IEC 61189-5-601 (359039)
We recommend:
Updating of laws
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
