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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Translate name
STANDARD published on 1.4.2020
Designation standards: ČSN EN IEC 62878-1
Classification mark: 359378
Catalog number: 509546
Publication date standards: 1.4.2020
SKU: NS-989669
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421
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