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Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Translate name
STANDARD published on 1.8.2025
Designation standards: ČSN EN IEC 62878-2-603
Classification mark: 359378
Catalog number: 521881
Publication date standards: 1.8.2025
SKU: NS-1227563
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM)
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Latest update: 2026-03-13 (Number of items: 2 266 261)
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