Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
ČSN EN IEC 63378-6 (358784)
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Translate name
STANDARD published on 1.9.2026
The information about the standard:
Designation standards: ČSN EN IEC 63378-6
Classification mark: 358784
Catalog number: 523840
Publication date standards: 1.9.2026
SKU: NS-1282614
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Annotation of standard text ČSN EN IEC 63378-6 (358784):
Tato norma stanoví model tepelného odporu a kapacity pro polovodičová pouzdra. Tento model se nazývá modelem digitální transformace s použitím tepelného odporu a kapacity (DXRC). Předpovídá přechodovou teplotu na přechodu a měřicích bodech.
Norma se týká polovodičových pouzder jako jsou TO-252, TO-263 a HSOP. Podporuje jednočipová pouzdra, která odvádějí teplo z povrchu jednoho pouzdra
Preview of the standard ČSN EN IEC 63378-6 (358784)
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
