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Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation.
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STANDARD published on 1.6.2024
Designation standards: DIN 50003:2024-06
Publication date standards: 1.6.2024
SKU: NS-1183590
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung.
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