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Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA).
STANDARD published on 1.8.2013
Designation standards: DIN EN 60191-6-22:2013-08
Publication date standards: 1.8.2013
SKU: NS-236841
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-22: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Halbleitergehäuse Si-Feinraster-Ball-Grid-Array und Si-Feinraster-Land-Grid-Array (S-FBGA und S-FLGA).
1.10.2001
WITHDRAWN
1.11.2007
1.7.2000
1.8.2006
1.6.2010
1.8.2002
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