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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices.
STANDARD published on 1.6.2011
Designation standards: DIN EN 60749-15:2011-06
Note: WITHDRAWN
Publication date standards: 1.6.2011
SKU: NS-237798
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage.
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