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WITHDRAWN DIN EN 60749-20:2003-12 1.12.2003 preview

DIN EN 60749-20:2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat.



STANDARD published on 1.12.2003


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112.10 USD

The information about the standard:

Designation standards: DIN EN 60749-20:2003-12
Note: WITHDRAWN
Publication date standards: 1.12.2003
SKU: NS-237806
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN

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Annotation of standard text DIN EN 60749-20:2003-12 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme.

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