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WITHDRAWN DIN EN 60749-20:2010-04 1.4.2010 preview

DIN EN 60749-20:2010-04

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.



STANDARD published on 1.4.2010


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The information about the standard:

Designation standards: DIN EN 60749-20:2010-04
Note: WITHDRAWN
Publication date standards: 1.4.2010
SKU: NS-237807
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: German technical standard
Category: Technical standards DIN

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Annotation of standard text DIN EN 60749-20:2010-04 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme.

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