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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability.
STANDARD published on 1.6.2005
Designation standards: DIN EN 60749-21:2005-06
Note: WITHDRAWN
Publication date standards: 1.6.2005
SKU: NS-237809
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit.
Latest update: 2026-08-28 (Number of items: 2 298 625)
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