E DIN EN ISO 9453:20..
Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
DIN EN 61190-1-1:2003-01
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
STANDARD published on 1.1.2003
The information about the standard:
Designation standards: DIN EN 61190-1-1:2003-01
Publication date standards: 1.1.2003
SKU: NS-238512
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN
The category - similar standards:
Annotation of standard text DIN EN 61190-1-1:2003-01 :
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage.
Similar standards:
1.9.2003
WITHDRAWN
1.12.2006
WITHDRAWN
1.4.2013
WITHDRAWN
1.2.2014
WITHDRAWN
1.9.2000
1.1.2013
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
