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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly.
STANDARD published on 1.11.2014
Designation standards: DIN EN 61190-1-2:2014-11
Publication date standards: 1.11.2014
SKU: NS-238515
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: German technical standard
Category: Technical standards DIN
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.
1.9.2013
WITHDRAWN
1.8.2013
1.2.2014
WITHDRAWN
1.1.1972
1.5.2006
WITHDRAWN
1.11.1977
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