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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly.
Translate name
STANDARD published on 1.12.2023
Designation standards: DIN EN IEC 60749-10:2023-12
Publication date standards: 1.12.2023
SKU: NS-1158627
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe.
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