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Standard DIN EN IEC 60749-20:2023-07 1.7.2023 preview

DIN EN IEC 60749-20:2023-07

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.

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STANDARD published on 1.7.2023


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The information about the standard:

Designation standards: DIN EN IEC 60749-20:2023-07
Publication date standards: 1.7.2023
SKU: NS-1143686
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: German technical standard
Category: Technical standards DIN

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Semiconductor devices in general

Annotation of standard text DIN EN IEC 60749-20:2023-07 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme.

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