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WITHDRAWN DIN EN IEC 61189-3-302:2026-08 1.8.2026 preview

DIN EN IEC 61189-3-302:2026-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT).

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STANDARD published on 1.8.2026


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The information about the standard:

Designation standards: DIN EN IEC 61189-3-302:2026-08
Note: WITHDRAWN
Publication date standards: 1.8.2026
SKU: NS-1274659
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN

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Annotation of standard text DIN EN IEC 61189-3-302:2026-08 :

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Computertomographisches Verfahren (CT) zur Detektion von Metallisierungsfehlern in unbestückten Leiterplatten.

Latest update: 2026-07-16 (Number of items: 2 287 999)
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