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Standard DIN EN IEC 61190-1-3:2018-09 1.9.2018 preview

DIN EN IEC 61190-1-3:2018-09

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.

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STANDARD published on 1.9.2018


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The information about the standard:

Designation standards: DIN EN IEC 61190-1-3:2018-09
Publication date standards: 1.9.2018
SKU: NS-857099
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: German technical standard
Category: Technical standards DIN

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The category - similar standards:

Electronic component assemblies

Annotation of standard text DIN EN IEC 61190-1-3:2018-09 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten.

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