We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity.
Translate name
STANDARD published on 1.3.2026
Designation standards: DIN EN IEC 62878-2-603:2026-03
Publication date standards: 1.3.2026
SKU: NS-1260943
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN
Montageverfahren für eingebettete Bauteile - Teil 2-603: Leitfaden für gestapelte Elektronikmodule - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls.
Latest update: 2026-04-01 (Number of items: 2 270 267)
© Copyright 2026 NORMSERVIS s.r.o.