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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.
STANDARD published on 1.10.2007
Designation standards: E DIN EN 60749-20:2007-10
Note: WITHDRAWN
Publication date standards: 1.10.2007
SKU: NS-291907
The number of pages: 45
Approximate weight : 135 g (0.30 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente gegenüber der kombinierten Beanspruchung durch Feuchtigkeit und Lötwärme.
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