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WITHDRAWN E DIN EN 60749-20:2007-10 1.10.2007 preview

E DIN EN 60749-20:2007-10 (Draft)

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.



STANDARD published on 1.10.2007


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The information about the standard:

Designation standards: E DIN EN 60749-20:2007-10
Note: WITHDRAWN
Publication date standards: 1.10.2007
SKU: NS-291907
The number of pages: 45
Approximate weight : 135 g (0.30 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN 60749-20:2007-10 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente gegenüber der kombinierten Beanspruchung durch Feuchtigkeit und Lötwärme.

Latest update: 2026-06-10 (Number of items: 2 281 585)
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