WITHDRAWN E DIN EN 61189-5-601:2018-11 1.11.2018 preview

E DIN EN 61189-5-601:2018-11 (Draft)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards.

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STANDARD published on 1.11.2018


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The information about the standard:

Designation standards: E DIN EN 61189-5-601:2018-11
Note: WITHDRAWN
Publication date standards: 1.11.2018
SKU: NS-902567
The number of pages: 72
Approximate weight : 216 g (0.48 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

Annotation of standard text E DIN EN 61189-5-601:2018-11 :

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-601: Allgemeine Prüfverfahren für Materialien und Baugruppen - Prüfverfahren für die Aufschmelz-Lötfähigkeit für Lötverbindungen und die Aufschmelz-Lötwärmebeständigkeit von Leiterplatten.

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