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WITHDRAWN E DIN EN 62047-18:2011-06 1.6.2011 preview

E DIN EN 62047-18:2011-06 (Draft)

Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials.



STANDARD published on 1.6.2011


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The information about the standard:

Designation standards: E DIN EN 62047-18:2011-06
Note: WITHDRAWN
Publication date standards: 1.6.2011
SKU: NS-292593
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN 62047-18:2011-06 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe.

Latest update: 2025-07-07 (Number of items: 2 207 474)
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