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WITHDRAWN E DIN EN 62047-27:2015-08 1.8.2015 preview

E DIN EN 62047-27:2015-08 (Draft)

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).



STANDARD published on 1.8.2015


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The information about the standard:

Designation standards: E DIN EN 62047-27:2015-08
Note: WITHDRAWN
Publication date standards: 1.8.2015
SKU: NS-603241
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN 62047-27:2015-08 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 27: Prüfung der Bondfestigkeit von Glasfritt gebondeten Strukturen unter Verwendung des Mikro-Chevron-Tests (MCT).

Latest update: 2025-07-07 (Number of items: 2 207 474)
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