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WITHDRAWN E DIN EN 62880-1:2014-08 1.8.2014 preview

E DIN EN 62880-1:2014-08 (Draft)

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method.



STANDARD published on 1.8.2014


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The information about the standard:

Designation standards: E DIN EN 62880-1:2014-08
Note: WITHDRAWN
Publication date standards: 1.8.2014
SKU: NS-292902
The number of pages: 64
Approximate weight : 192 g (0.42 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN 62880-1:2014-08 :

Halbleiterbauelemente - Zuverlässigkeit auf Waferniveau für Halbleiterbauelemente - Teil 1: Prüfverfahren zur Stressmigration von Kupfer.

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