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Standard E DIN EN IEC 60749-20-1:2018-11 1.11.2018 preview

E DIN EN IEC 60749-20-1:2018-11 (Draft)

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat.

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STANDARD published on 1.11.2018


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174.70 USD

The information about the standard:

Designation standards: E DIN EN IEC 60749-20-1:2018-11
Publication date standards: 1.11.2018
SKU: NS-902577
The number of pages: 79
Approximate weight : 237 g (0.52 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Semiconductor devices in general

Annotation of standard text E DIN EN IEC 60749-20-1:2018-11 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind.

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