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WITHDRAWN E DIN EN IEC 60749-20:2019-10 1.10.2019 preview

E DIN EN IEC 60749-20:2019-10 (Draft)

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.

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STANDARD published on 1.10.2019


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The information about the standard:

Designation standards: E DIN EN IEC 60749-20:2019-10
Note: WITHDRAWN
Publication date standards: 1.10.2019
SKU: NS-971200
The number of pages: 56
Approximate weight : 168 g (0.37 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN IEC 60749-20:2019-10 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme.

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