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Standard E DIN EN IEC 60749-22-2:2026-11 1.11.2026 preview

E DIN EN IEC 60749-22-2:2026-11 (Draft)

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods.

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STANDARD published on 1.11.2026


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The information about the standard:

Designation standards: E DIN EN IEC 60749-22-2:2026-11
Publication date standards: 1.11.2026
SKU: NS-1288189
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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The category - similar standards:

Semiconductor devices in general

Annotation of standard text E DIN EN IEC 60749-22-2:2026-11 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit - Drahtbond-Scherprüfverfahren.

Latest update: 2026-11-03 (Number of items: 2 209 039)
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