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WITHDRAWN E DIN EN IEC 60749-37:2023-02 1.2.2023 preview

E DIN EN IEC 60749-37:2023-02 (Draft)

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer.

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STANDARD published on 1.2.2023


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The information about the standard:

Designation standards: E DIN EN IEC 60749-37:2023-02
Note: WITHDRAWN
Publication date standards: 1.2.2023
SKU: NS-1100663
The number of pages: 42
Approximate weight : 126 g (0.28 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN IEC 60749-37:2023-02 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes.

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