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WITHDRAWN E DIN EN IEC 61189-3-302:2025-11 1.11.2025 preview

E DIN EN IEC 61189-3-302:2025-11 (Draft)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT).

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STANDARD published on 1.11.2025


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The information about the standard:

Designation standards: E DIN EN IEC 61189-3-302:2025-11
Note: WITHDRAWN
Publication date standards: 1.11.2025
SKU: NS-1244639
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN IEC 61189-3-302:2025-11 :

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT).

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