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Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices.
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STANDARD published on 1.6.2022
Designation standards: E DIN EN IEC 63215-5:2022-06
Publication date standards: 1.6.2022
SKU: NS-1058125
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 5: Verfahren für die Temperaturwechselprüfung und Funktionsfähigkeitsindex von Werkstoffen zum Chip-Bonden zur Verwendung an leistungselektronischen Bauelementen.
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