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WITHDRAWN E DIN EN IEC 63378-3:2026-08 1.8.2026 preview

E DIN EN IEC 63378-3:2026-08 (Draft)

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis.

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STANDARD published on 1.8.2026


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The information about the standard:

Designation standards: E DIN EN IEC 63378-3:2026-08
Note: WITHDRAWN
Publication date standards: 1.8.2026
SKU: NS-1274791
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN EN IEC 63378-3:2026-08 :

Thermische Standardisierung von Halbleitergehäusen - Teil 3: Thermische Schaltungssimulationsmodelle von diskreten Halbleitergehäusen für die Transientenanalyse.

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