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WITHDRAWN E DIN IEC 60191-6-15:2007-03 1.3.2007 preview

E DIN IEC 60191-6-15:2007-03 (Draft)

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).



STANDARD published on 1.3.2007


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The information about the standard:

Designation standards: E DIN IEC 60191-6-15:2007-03
Note: WITHDRAWN
Publication date standards: 1.3.2007
SKU: NS-302595
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN IEC 60191-6-15:2007-03 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-15: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP).

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