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WITHDRAWN E DIN IEC 60191-6-20:2009-02 1.2.2009 preview

E DIN IEC 60191-6-20:2009-02 (Draft)

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).



STANDARD published on 1.2.2009


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The information about the standard:

Designation standards: E DIN IEC 60191-6-20:2009-02
Note: WITHDRAWN
Publication date standards: 1.2.2009
SKU: NS-302599
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN IEC 60191-6-20:2009-02 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-20: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen mit J-förmigen Anschlüssen (SOJ).

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