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  4. Standard "E DIN IEC 60191-6-9:2002-07"
WITHDRAWN E DIN IEC 60191-6-9:2002-07 1.7.2002 preview

E DIN IEC 60191-6-9:2002-07 (Draft)

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP).



STANDARD published on 1.7.2002


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The information about the standard:

Designation standards: E DIN IEC 60191-6-9:2002-07
Note: WITHDRAWN
Publication date standards: 1.7.2002
SKU: NS-302602
The number of pages: 33
Approximate weight : 99 g (0.22 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN IEC 60191-6-9:2002-07 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-9: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleiterbauelementen; Konstruktionsleitfaden für integrierte Schaltkreise mit quadratischem Kunststoffflachgehäuse (P-QFP).

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