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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices.
STANDARD published on 1.2.2005
Designation standards: E DIN IEC 60749-20-1:2005-02
Note: WITHDRAWN
Publication date standards: 1.2.2005
SKU: NS-303079
The number of pages: 52
Approximate weight : 156 g (0.34 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung, Transport und Einsatz von feuchte/reflowlöt-empfindlichen oberflächenmontierbaren Bauelementen.
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