We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices.
STANDARD published on 1.2.2005
Designation standards: E DIN IEC 60749-20-1:2005-02
Note: WITHDRAWN
Publication date standards: 1.2.2005
SKU: NS-303079
The number of pages: 52
Approximate weight : 156 g (0.34 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung, Transport und Einsatz von feuchte/reflowlöt-empfindlichen oberflächenmontierbaren Bauelementen.
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
Latest update: 2026-04-24 (Number of items: 2 274 650)
© Copyright 2026 NORMSERVIS s.r.o.