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WITHDRAWN E DIN IEC 61190-1-2:2005-09 1.9.2005 preview

E DIN IEC 61190-1-2:2005-09 (Draft)

Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly.



STANDARD published on 1.9.2005


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The information about the standard:

Designation standards: E DIN IEC 61190-1-2:2005-09
Note: WITHDRAWN
Publication date standards: 1.9.2005
SKU: NS-303356
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN IEC 61190-1-2:2005-09 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.

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