We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly.
STANDARD published on 1.11.1998
Designation standards: E DIN IEC 91/141/CD:1998-11
Note: WITHDRAWN
Publication date standards: 1.11.1998
SKU: NS-304602
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
IEC 61190-1-1: Anschlussmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Fluxmittel für hochwertige Verbindungen bei der Elektronikmontage.
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2025-07-03 (Number of items: 2 207 355)
© Copyright 2025 NORMSERVIS s.r.o.