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Thermal standardization on semiconductor packages -- Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points (IEC 47D/991/CDV) (english version)
Translate name
STANDARD published on 1.7.2025
Designation standards: E ÖVE EN IEC 63378-6
Publication date standards: 1.7.2025
SKU: NS-1224833
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: Austrian technische Norm (Draft)
Category: Technical standards ÖNORM
Latest update: 2025-07-06 (Number of items: 2 207 474)
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