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Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
Translate name
STANDARD published on 23.5.2023
Designation standards: GB/T 15879.604-2023
Publication date standards: 23.5.2023
SKU: NS-1145335
Country: Chinese technical standard
Category: Technical standards GB
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