We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
Translate name
STANDARD published on 30.7.2026
Designation standards: GB/T 15879.618-2026
Note: Execute Date: february 2027
Publication date standards: 30.7.2026
SKU: NS-1280236
Country: Chinese technical standard
Category: Technical standards GB
Latest update: 2026-10-20 (Number of items: 2 307 718)
© Copyright 2026 NORMSERVIS s.r.o.