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Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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STANDARD published on 30.4.2026
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Designation standards: GB/T 4937.201-2026
Note: Execute Date: november 2026
Publication date standards: 30.4.2026
SKU: NS-1270096
Country: Chinese technical standard
Category: Technical standards GB
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