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IEC 60068-2-58-ed.4.0/Amd.1
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Translate name
STANDARD published on 28.7.2017
The information about the standard:
Designation standards: IEC 60068-2-58-ed.4.0/Amd.1
Note: Change
Publication date standards: 28.7.2017
SKU: NS-688837
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
This change (correction) applies to this standard:
IEC 60068-2-58-ed.4.0
Show all technical information.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
(Essais d´environnement - Partie 2-58: Essais - Essai Td: Methodes d´essai de la soudabilite, resistance de la metallisation a la dissolution et resistance a la chaleur de brasage des composants pour montage en surface (CMS))
Standard published on 27.3.2015
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