Change IEC 60068-2-58-ed.4.0/Amd.1 28.7.2017 preview

IEC 60068-2-58-ed.4.0/Amd.1

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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STANDARD published on 28.7.2017


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The information about the standard:

Designation standards: IEC 60068-2-58-ed.4.0/Amd.1
Note: Change
Publication date standards: 28.7.2017
SKU: NS-688837
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Environmental testingElectronic component assemblies

This change (correction) applies to this standard:

IEC 60068-2-58-ed.4.0

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
(Essais d´environnement - Partie 2-58: Essais - Essai Td: Methodes d´essai de la soudabilite, resistance de la metallisation a la dissolution et resistance a la chaleur de brasage des composants pour montage en surface (CMS))

Standard published on 27.3.2015

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