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IEC 60068-2-69-ed.3.0
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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STANDARD published on 7.3.2017
The information about the standard:
Designation standards: IEC 60068-2-69-ed.3.0
Publication date standards: 7.3.2017
SKU: NS-677379
The number of pages: 110
Approximate weight : 361 g (0.80 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60068-2-69-ed.3.0 :
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated. The contents of the corrigendum of January 2018 have been included in this copy. LIEC 60068-2-69:2017 specifie lessai Te/Tc, la methode de la balance de mouillage au bain de brasure et la methode de la balance de mouillage a la goutte de brasure, pour determiner quantitativement la brasabilite des sorties. Ces methodes ne servent pas a fournir des donnees quantitatives absolues utilisees dans le cadre dacception ou de rejet. Les modes operatoires decrivent la methode de la balance de mouillage au bain de brasure ainsi que la methode de la balance de mouillage a la goutte de brasure. Ces deux methodes sont applicables aux composants et aux cartes imprimees munis de sorties metalliques et de plots de brasage metallises. Le present document fournit les modes operatoires de mesure pour les alliages de brasage avec et sans plomb (Pb). Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - integration de lIEC 60068-2-54; - introduction dessais de cartes imprimees; - integration de nouveaux types de composants et actualisation des parametres dessai pour la liste complete des composants; - introduction dun nouveau protocole dessai R&R de jauge pour assurer que la balance de mouillage est correctement etalonnee. Le contenu du corrigendum de janvier 2018 a ete pris en consideration dans cet exemplaire.
These changes apply to this standard:
IEC 60068-2-69-ed.3.0/Amd.1
Change
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Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
(Amendement 1 - Essais d´environnement - Partie 2-69: Essais - Essai Te/Tc : Essai de brasabilite des composants electroniques et cartes imprimees par la methode de la balance de mouillage (mesure de la force))
Change published on 19.6.2019
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These corrections apply to this standard:
IEC 60068-2-69-ed.3.0/Cor.1
Correction
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Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
(Corrigendum 1 - Essais d´environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilite des composants electroniques et cartes imprimees par la methode de la balance de mouillage (mesure de la force))
Correction published on 24.1.2018
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