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IEC 60115-2-10-ed.1.0
Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
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STANDARD published on 15.2.2023
The information about the standard:
Designation standards: IEC 60115-2-10-ed.1.0
Publication date standards: 15.2.2023
SKU: NS-1135617
The number of pages: 46
Approximate weight : 138 g (0.30 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60115-2-10-ed.1.0 :
IEC 60115-2-10:2023 is a detail specification which specifies the characteristics and ratings of low-power film resistors with leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q. This first edition cancels and replaces IEC 60115-2-1:1982. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: it employs the product classification based on application requirements as defined in the generic specification IEC 60115-1:2020; it permits the specification of additional dimensional requirements concerning the eccentricity of termination wires and the coating extending onto wires; it provides for a tabulated presentation of resistance ranges in relationship to the temperature coefficient and the tolerance; it supports solderability testing for both traditional lead-bearing soldering and up-to-date lead-free soldering, as required; it introduces a test for the specimens’ robustness to electrostatic discharge; it introduces a test for the specimens’ resistance to solvents; it introduces a test for the flammability of the specimens; it employs consistent stability requirements grouped in stability classes; it supports the provision of detailed visual acceptance criteria; it includes the requirement for a visual examination of the primary and proximity packaging; it provides the correlated test schedules for a qualification approval and for subsequent quality conformance inspections side by side; it employs quality assessment procedures which meet the requirements of a zero-defect approach, which evades the use of historic AQL levels and the permission of non-conforming specimens in test groups; it provides for the inclusion of specific visual acceptance criteria, to be applied in addition to those given in Annex B of the sectional specification IEC 60115-2:2023; it provides for the optional coverage of 0 ohm resistors (jumpers) within the scope of the drafted detail specification; furthermore, it employs a new document structure, for which a transition guidance is provided in Annex X. LIEC 60115-2-10:2023 specifie les caracteristiques et valeurs assignees des resistances a broches a couche, a faible dissipation, utilisees dans les equipements electroniques, et qui sont generalement assemblees sur les cartes de circuit imprime au moyen de la technologie a trous traversants (THT). Cette premiere edition annule et remplace l’IEC 60115-2-1:1982. Cette edition constitue une revision technique. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: a) recours a la classification de produit basee sur les exigences d’application, telle qu’elle est definie dans la specification generique IEC 60115-1:2020; b) autorisation de la specification d’exigences dimensionnelles supplementaires, concernant l’excentricite des fils de sortie et la prolongation du revetement sur ces fils; c) presentation sous forme de tableau des plages de resistances, en relation avec le coefficient de temperature et la tolerance; d) acceptation des essais de brasabilite couvrant a la fois la brasure traditionnelle contenant du plomb et la brasure plus contemporaine, sans plomb, selon ce qui est exige; e) introduction d’un essai couvrant la robustesse des eprouvettes aux decharges electrostatiques; f) introduction d’un essai couvrant la robustesse des eprouvettes aux solvants; g) introduction d’un essai couvrant l’inflammabilite des eprouvettes; h) recours a des exigences de stabilite homogenes regroupees dans des classes de stabilite; i) prise en charge de la specification de criteres d’acceptation visuelle detailles; j) specification d’une exigence d’examen visuel portant sur l’emballage principal et l’emballage de proximite; k) specification groupee des programmes d’essais correles pour l’homologation et les controles ulterieurs de conformite de la qualite; l) recours a des procedures d’assurance de la qualite satisfaisant aux exigences d’une approche zero defaut, qui evite l’utilisation des anciens niveaux NQA et l’autorisation d’eprouvettes non conformes au sein de groupes d’essai; m) inclusion de criteres d’acceptation visuelle specifiques, s’appliquant en complement de ceux donnes a l’Annexe B de la specification intermediaire IEC 60115-2:2023; n) couverture facultative des resistances 0 ohm (cavaliers) relevant du domaine d’application du projet de specification particuliere; o) recours a une nouvelle structure documentaire, avec des recommandations facilitant la transition vers celle-ci donnees a l’Annexe X.
