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IEC 60191-6-21-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
STANDARD published on 30.8.2010
The information about the standard:
Designation standards: IEC 60191-6-21-ed.1.0
Publication date standards: 30.8.2010
SKU: NS-409112
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-21-ed.1.0 :
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. La CEI 60191-6-21:2010 specifie les methodes destinees a mesurer les dimensions des boitiers de faible encombrement SOP, lencombrement des boitiers de forme E conformement a la CEI 60191-4.
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