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IEC 60191-6-4-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
STANDARD published on 11.6.2003
The information about the standard:
Designation standards: IEC 60191-6-4-ed.1.0
Publication date standards: 11.6.2003
SKU: NS-409115
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-4-ed.1.0 :
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. La CEI 60191-6-4:2003 couvre les exigences relatives aux methodes de mesure des dimensions des boitiers matriciels a billes (BGA).
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