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IEC 60269-4-ed.6.0-CMV
Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
Translate name
STANDARD published on 9.8.2024
The information about the standard:
Designation standards: IEC 60269-4-ed.6.0-CMV
Publication date standards: 9.8.2024
SKU: NS-1194481
The number of pages: 147
Approximate weight : 472 g (1.04 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60269-4-ed.6.0-CMV :
IEC 60269-4:2024 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC 60269-4:2024 edition 6.0 and the previous IEC 60269-4:2009+AMD1:2012+AMD2:2016 CSV edition 5.2. Furthermore, comments from IEC SC 32B experts are provided to explain the reasons of the most relevant changes, or to clarify any part of the content. IEC 60269-4:2024 applies with the following supplementary requirements. Fuse-links for the protection of semiconductor devices shall comply with aIl requirements of IEC 60269-1, if not otherwise indicated hereinafter, and shall also comply with the supplementary requirements laid down below. These supplementary requirements apply to fuse-links for application in equipment containing semiconductor devices for circuits of nominal voltages up to 1 000 V AC or 1 500 V DC. For some fuse-links higher rated voltages can be used.
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