Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 60317-35-ed.2.2+Amd.1+Amd.2-CSV
Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
Translate name
STANDARD published on 14.6.2024
The information about the standard:
Designation standards: IEC 60317-35-ed.2.2+Amd.1+Amd.2-CSV
Publication date standards: 14.6.2024
SKU: NS-1187380
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60317-35-ed.2.2+Amd.1+Amd.2-CSV :
IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 0,800 mm; - Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - modification to Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
