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IEC 60748-23-2-ed.1.0
Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
STANDARD published on 23.5.2002
The information about the standard:
Designation standards: IEC 60748-23-2-ed.1.0
Publication date standards: 23.5.2002
SKU: NS-411346
The number of pages: 97
Approximate weight : 322 g (0.71 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60748-23-2-ed.1.0 :
Applies to high quality approval systems for hybrid integrated circuits and film structures. The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave. These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturers quality control and handling procedures.
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