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IEC 60749-10-ed.2.0
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
Translate name
STANDARD published on 27.4.2022
The information about the standard:
Designation standards: IEC 60749-10-ed.2.0
Publication date standards: 27.4.2022
SKU: NS-1055611
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-10-ed.2.0 :
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition: covers both unattached components and components attached to printed wiring boards; tolerance limits modified for peak acceleration and pulse duration; mathematical formulae added for velocity change and equivalent drop height. L’IEC 60749-10:2022 est destinee a evaluer les dispositifs a l’etat libre et ceux qui sont assembles a des cartes a cablage imprime pour etre utilises dans des materiels electriques. Cette methode est destinee a determiner la capacite des dispositifs et des sous-ensembles a resister a des chocs d’une severite moderee. L’utilisation de sous-ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques a celles des dispositifs montes sur des cartes a cablage imprime. Les chocs mecaniques dus a l’application soudaine de forces ou a de brusques modifications de deplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caracteristiques de fonctionnement, en particulier si les impulsions de choc sont repetitives. Il s’agit ici d’un essai destructif destine a la qualification des dispositifs. Cette edition annule et remplace la premiere edition parue en 2002. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) Elle couvre a la fois les composants qui sont fixes sur des cartes a cablage imprime et ceux qui ne le sont pas; b) les limites des tolerances ont ete modifiees pour lacceleration de crete et la duree d’impulsion; c) des formules mathematiques ont ete ajoutees concernant la variation de vitesse et la hauteur de chute equivalente.
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