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IEC 60749-20-ed.3.0
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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STANDARD published on 31.8.2020
The information about the standard:
Designation standards: IEC 60749-20-ed.3.0
Publication date standards: 31.8.2020
SKU: NS-1004557
The number of pages: 55
Approximate weight : 165 g (0.36 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-20-ed.3.0 :
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes. L’IEC 60749-20:2020 fournit des moyens d’evaluer la resistance a la chaleur de brasage des semiconducteurs sous emballage comme les composants a boitier plastique pour montage en surface (CMS). Cet essai est destructif. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: - incorporation d’un corrigendum de l’IEC 60749-20:2008 (deuxieme edition), - inclusion d’un nouvel Article 3, - inclusion de notes explicatives.
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